Gas plasma is a low temperature, glow discharge, vacuum process which
utilizes small quantities of electrically energized gasses in place of
gallons of solvents and acids. In addition to lowering chemical usage, the
process offers greater repeatability than wet cleaning, does no damage to
materials, and leaves no residues behind. It is used in semiconductor
processes, surface preparation of electronic materials, and cleaning of
other industrial materials and components.
A typical precision cleaning process may be accomplished in 15 minutes or
less by using low pressure oxygen molecules to reactive oxygen atoms, ions,
electrons and light (collectively called a plasma). These reactive
components will gently oxidize thin organic films from the surface of glass,
ceramics, plastics or other high tech materials producing trace amounts of
harmless byproducts (carbon dioxide and water vapor) which are removed by
the system vacuum pump during the process.
Plasma is used in semiconductor processes to selectively etch, or ash/strip,
semiconductor materials during microcircuit fabrication. Plasma is used in
"micromachining" (building microscopic structures, such as light switches).
Plasma is also used in surface modification: oxygen cleaned plasma surfaces
exhibit a very fine (almost invisible) texture and are more polar as a
result of oxidation. Both of these factors will contribute to greatly
enhanced bonds of adhesives, or paints.
