Tegal Mod. 803 Plasma Oxide Etch System wafer transport compatible with 3, 4, and 5"
wafers (set up for 4" wafers) single wafer cassette
to cassette operation
Physical Dimensions: 23"H x 33"D x 45"W
- 34-1/8"H w/cover open
Electrical requirements: 120VAC/1Ph/60Hz/15A
Wafer cup and chamber top are water cooled
Four mass flow controllers
MKS Baratron vacuum gauge
2 channel system logic, with one clean channel
RF Generator 500W @ 13.56 MHz
fully automatic matching network
