| |
Gasonics PEP 3510A/C single wafer downstream microwave
Ash/clean system
* Flush Mount configuration
* Automatic/manual operation modes
* Single chamber wafer processing (up to 2 process modules),
100-200mm wafers
* Software process monitoring of all functions
* IBM 758X Industrial PC with floppy and hard drive,
OS2 Operating system
* Graphical user touch screen interface (GUI)
* Multiple lot, sequential processing using different
recipes
* Damage-free, downstream microwave source
* Multi-mode wafer handling: parallel, sequential, and
independent
Wafer Handler:
* Load Station with: touch screen control
* EMO button
* Ethernet Mouse/keyboard connector
* Brushed stainless exterior/front, with plexiglass
windows
* dual cooling platens
* Fixed position load/unload stations
* Hepa Air filter
* cassette to cassette operation, with Kensington robot
indexer/loader, and 4000 controller
* Ethernet/SECS port
Ash Chamber (right PCM)
* Gasonics 3510A/A (R), S/N PEP1-8L, config. 95-0482,
Diag 98-1182, 208VAC/60Hz/30A 2Ph Wye
* Ash chamber (right), quartz/aluminum chamber, with
viton Orings
* Plasma chamber/interconnections set up with Kalrez
orings
* Single point gas distribution box, set up to customer
specs, including MFCs: O2 @ 4 LPM, N2 @ 200 CCM, N2
@ 2 LPM.
* microwave, damage-free resist removal applications
* AGL Mod. C13170 Microwave generator, 1.25KW @ 2.45GHz
* Automatic pneumatic wafer soft-lift assembly
* Closed-loop, termperature controlled (preheating only
w/resistance heater), electrically-isolated wafer platen,
assisted by quartz heat lamps
* EOP detection, tuned to 308nm
* ISO80 vacuum connection facing down (through floor
vacuum connection)
Clean Chamber (left PCM)
• Gasonics 3510A/DPR (L), S/N M960110
• Clean Chamber (left) ceramic/aluminum chamber,
100-200mm wafers
• Microwave (2.45Ghz) damage free cleaning applications
• Automatic pneumatic wafer soft-lift assembly
• Platen Fluid Heat/Cool controlled
AC Power Distribution module, wall mount
|
|
