Branson/IPC Mod. L3200 single wafer downstream
stripper
Reactor Center
* Dual quartz chambers for 100-150mm wafers, cassette to casette
operation
* Automatic pneumatic soft-lift assemblies for each chamber
* In-line gas filters (0.05 micron)
* Two PM 732 automatch networks
* Quartz halogen lamp for preheating
* Process capabilities: positive and negative resist, hardened
resist, polyimide (note: Plasmatek does not guarantee any
process performance)
Process control and instrumentation
* Microprocessor controller, menu driven
* 20 recipes maximum
* Programmable Process Parameters: Gas Flow, Chamber Pressure,
RF Power, Strip time, Heat Lamp On time, overstrip time
* Programmable Tolerance Limits: RF Power (forward and reflected),
Time, Pressure, Gas flow, Pumpdown
* Automatic pressure control
* CRT system status display
* Programmable tolerance limit alarm
* Sixty four key, alphanumeric keypad for entry of process
and system parameters
* seventy two hour battery backed RAM for program memory
Gas Handling Module and Control Features
* Two process gas lines and one purge line to include: One
O2 @ 4000 SCCM mass flow controller, Optional gas (blank),
fast and slow N2 purge
* All Stainless steel valves and gas lines
* Automatic variable throttle valve for pressure control
* Separate capacitance manometers for each chamber with isolation
valve
Wafer Handling and Sensing
* Automatic pick-and-place wafer handling
* Two elevator cassette stands for send-to-receive operation
DC Power Module
* Distributes AC/DC power to system
System Power Control Panel
* AC ON/OFF for system power, RF generator, and vacuum pumps
Power Cabinet Assembly
* 510 Power Distribution Module
* Wafer Heating Module
* Separate control for system power, RF generator, and vacuum
pumps control signal
* Shielded high-voltage components
* Emergency OFF switches
* Cover safety interlocks
* 12-VAC control to complete system
* ENI Mod.-12A RF Generator, 13.56MHz, crystal controlled,
0-1000 watts, continuously rated, Solid state, water-cooled
Safety and Security Features
* All covers interlocked
* Emergency OFF switches
* Electronic and software interlocks for RF power, wafer heating
and gas flow
Facility Requirements
* Compressed air: 60 to 120 psig (clean and dry)
* System Electrical power: 200 to 240VAC, 40 amp, 1 phase,
50/60 Hz
* Wafer Heating power: 200 to 240VAC, 15 amp, 1 phase, 50/60
Hz
* Cooling water: 1.2 gal/min (house water, filtered) for RF
generator
* House vacuum: at leastg .8CFM @ 20 inches Hg
* Mainframe air exhaust: 4 inch duct flange, 100 CFM
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